Description
As part of the Backend Operations, you will be responsible for Back End Test Scan/Pack/AOI Process Engineering.
In your new role you will:
Be responsible for Back End Test Scan/Pack/AOI Process Engineering:
Design, characterize, control and optimize processes towards stability, support production ramp up
Lead & drive process and quality improvement through APC(Advanced Process Control) & SPC (Statistical Process Control):
Lead & drive deviation management, crisis management, risk management and mitigation
- *Update Process Flow/ Control Plan /FMEA /SOP/OCAP *and conduct training /upskill for technicians & operators
Support defect characterization, commonality studies and yield improvement initiatives *via *data analysis and machine learning:
Qualification of 2nd source packing materials, support qualification and release of new process and equipment
You are best equipped for this task if you have:
- Degree in *Process/Electrical/Electronics/Mechanical Engineering *or equivalent
- Minimum *3 years of working experience in semiconductor manufacturing *industry
Expertise in FMEA, Lean Six Sigma, 8D Methodology and APC / SPC:
Experience in IATF16949 standard, change management and data analysis:
Strong problem solving and good communication / leadership skills
- Knowledge in **packing material such as carrier tape & cover tape, experience in AOI equipment will be advantageous