Descrição
Responsibilities:
- Perform mechanical, thermo-mechanical analysis and characterization of advanced IC packages
- Build up new mechanical and thermo-mechanical capabilities with latest simulation and characterization technologies
- Design advanced packages for customers to meet their reliability and manufacturability specifications and needs
- Assess the feasibility of new packaging assembly and process technologies with respect to mechanical and reliability performance
- Conduct IC packaging technology development together with other teams
- Carry out mechanical and reliability test and correlate with mechanical and thermo-mechanical simulation for validation
Requirements:
- Master/Bachelor’s degree in Mechanical Engineering or related with 5-year experience in mechanical modelling for IC package’s stress and warpage, board-level reliability such as drop test and TCOB using simulation software such as Ansys or Abaqus
- Thermo-mechanical modelling experience for IC assembly moulding process, die stress/shifting in fan-out WLP, and wire bonding using simulation software such as Ansys & Abaqus is preferable
- Solid knowledge on FEM and mechanics of material
- Mechanical and reliability test experience such as drop test, TCOB test, warpage measurement, bending test, material strength test is highly desirable
- Keen for R&D activities in IC packaging technology development, package’s mechanical and thermo-mechanical analysis, design, optimization and characterization
- Registration No. R1333447_
- EA Licence No. 18C9464_
Job Types: Full-time, Permanent
Salary: $5,500.00 - $8,500.00 per month
Benefits:
- Dental insurance
- Health insurance
- Professional development
- Vision insurance
Schedule:
- Monday to Friday
Supplemental Pay:
- 13th month salary
- Performance bonus
Experience:
- in mechanical modelling for IC package’s stress and warpage: 5 years (preferred)